We employ a range of techniques including DPA (Destructive Physical Analysis) – Sectioning of potted assemblies to get a true sense of the behaviour of an assembly – functional analysis, tensile testing, material testing etc. Metrology is used at this point too and throughout the entire process using CT/Laser scanning or our CMM systems.

The services we provide in this area include;
3D Scanning
CT Scanning
Laser Scanning
Diamond Sectioning

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